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Tetrahedron of the Sn-Ag-Cu-Ni phase equilibria at 210°C. | Download Scientific Diagram
The Characteristics of Cu/Sn/Cu and Ni/Sn/Ni Sandwich Solder Systems for Gold-free Wafer Bonding Technology
Materials | Free Full-Text | Reactions in Electrodeposited Cu/Sn and Cu/Ni/ Sn Nanoscale Multilayers for Interconnects
Current-induced interfacial reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P flip chip interconnect | Journal of Materials Research | Cambridge Core
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
Studies on the Interfacial Reactions between Electroless Ni UBM and 95.5Sn -4.0Ag-0.5Cu Alloy
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging | Scientific Reports
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Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications | SpringerLink
Cu-Ni-Sn
Materials | Free Full-Text | Reactions in Electrodeposited Cu/Sn and Cu/Ni/ Sn Nanoscale Multilayers for Interconnects
Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules | SpringerLink
In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient | Journal of Materials Research | Cambridge Core
Cu–Ni–Sn–Si alloys designed by cluster-plus-glue-atom model - ScienceDirect
Cu-Ni-Sn: A Key System for Lead-Free Soldering
PDF] Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects | Semantic Scholar
Cu–Ni–Sn–Si alloys designed by cluster-plus-glue-atom model - ScienceDirect
Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration
Calculated isothermal section of Sn-Cu-Ni phase diagram at 800°C... | Download Scientific Diagram
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