Recommended Land Pattern for QFN 4.0x4.0 24 Lead
Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface-Mount Guidelines for Leadless Packages
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
AN005e: IC Package / PCB Footprint Guidelines - QFN28 5x5
QFN Component Package | mbedded.ninja
56-Pin Quad Flatpack No-Lead Logic Package
AN005e: IC Package / PCB Footprint Guidelines - QFN28 5x5
F0480 Datasheet
AN1902, Assembly Guidelines for QFN (Quad Flat No-Lead) and DFN (Dual Flat No-Lead) Packages - Application Note
Proto Advantage - LFCSP-28 (0.65 mm pitch, 6 x 6 mm body, 4.1 x 4.1 mm pad) PCB and Stencil Kit
FTDI Example IC PCB Footprints
Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability
pcb - Designing footprint for LFCSP CP-8-13 what should be the pad size - Electrical Engineering Stack Exchange
AN1902, Assembly Guidelines for QFN (Quad Flat No-Lead) and DFN (Dual Flat No-Lead) Packages - Application Note
FTDI Example IC PCB Footprints
AN005e: IC Package / PCB Footprint Guidelines - QFN28 5x5
FTDI Example IC PCB Footprints
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
QFN Component Package | mbedded.ninja
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
AN1902: Assembly guidelines for QFN and SON packages – Application Note
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
